Temperature recovery performance*3 | Thermal cycle test | Recovery conditions | Three-zone o Low temperature exposure: -65°C (30 minutes) o Ambient-temperature exposure: ambient temperature (10 minutes) o High temperature exposure: +150°C (30 minutes) · Power supply voltage: rated voltage · Sensor position: upstream |
Specimen: plastic mold IC 5kg | Specimen: plastic mold IC 10kg |
Recovery time | High temperature recovery: within 10 minutes (Ambient temperature→ +150°C) Low temperature recovery: within 10 minutes (Ambient temperature→ -65°C) | High temperature recovery: within 16 minutes (Ambient temperature→ +150°C) Low temperature recovery: within 16 minutes (Ambient temperature→ -65°C) |
Dew cycle test 1 | Recovery conditions | · Two-zone o Low temperature exposure: +5°C (20 minutes) o High temperature and humidity exposure operation : +25°C 90% (20 minutes) · Power supply voltage: rated voltage · Sensor position: upstream |
· Specimen: print substrate 2 kg | · Specimen: print substrate 5 kg |
Recovery time*4 | High temperature recovery: within 20 seconds (+5°C→+25°C 90%) Low temperature recovery: within 3 minutes (+25°C 90%rh→+5°C) | High temperature recovery: within 20 seconds (+5°C→+25°C 90%) Low temperature recovery: within 5 minutes (+25°C 90%rh→+5°C) |
Dew cycle test 2 | Recovery conditions*5 | · Two-zone o Low temperature exposure: -30°C (60 minutes) o High temperature and humidity exposure operation: +25°C 95% (60 minutes) o *Pre-heating temperature 25°C 95% · Power supply voltage: rated voltage · Sensor position: upstream · Specimen: no specimen |
Recovery time*4 | · High temperature and humidity recovery: within 5 minutes (-30°C→+25°C 95%) · Low temperature and humidity recovery: within 5 minutes (+25°C 95%rh→-30°C) |
Specimen basket load capacity | 5kg (Equally distributed load) |
Test area dimensions | W650×H460×D370mm | W650×H460×D670mm |
Outside dimensions | W1670×H1900×D1570mm (excluding protrusions) | W1670×H1900×D1870mm (excluding protrusions) |
Weight | Approx. 1,300 kg | Approx. 1,550 kg |